UV Curing System for up to 200 mm Wafers, Model UVC-408

UV CURING SYSTEM

MODEL UVC-408

The UV Curing system, Model UVC-408 can support up to 200mm (8-inch) wafers and is designed as a compact tabletop system for the first time in the industry. This system includes a high-pressure mercury UV lamp.

System Features

Applications

Equipped with a 1KW high-pressure mercury lamp
Can process up to 200mm (8″) wafers
Low-temperature UV exposure
Uniform exposure with rotating sample stage
Small, compact footprint
Allows complete curing of film surface by means of Nitrogen (N2) purge
Simple operation with a safety interlocks
Drawer loading mechanism
Built-in cooling fan
Built-in process timer and UV lamp hour counter
Peak wavelength: 365nm
System dimensions: 400(W) x 665(D) x 435(H) mm

UV-curable pressure sensitive adhesives (PSA)
Wire tacking
Surface mount bonding for speakers
Die attachments
Pin attachments
Sealing and gasketing products
Flex circuit reinforcement and relief
Ferrite magnet bonding
Flip chips
UV Curing of inks and coatings on:
- Printed circuit boards
- Wires
- Computer chips
- Cellphone, OLEDs and semiconductors
- Cables
- Ribbon cables
- Pins
- Smart cards
- Displays
- Video tape recorders
- Motors
- Disk drives