The UV-Ozone Cleaning System removes organic contaminants from work surfaces (up to 200×200 mm) and can also be used for surface modification. This system for dry cleaning requires no complicated structure and is best used in final cleaning steps for removal of trace organics.
System Features
Applications
Equipped with a high-density, ozone-producing UV grid lamp
Variable distance between the UV light source and sample stage
Uniformly clean up to 8″x8″ (200mm) samples
Low-temperature wafer cleaning
Small, compact foot print
Very easy to operate
Applicable to both double-side and single-side cleaning
Simple operation with a safety lock function
Drawer loading mechanism
Built-in exhaust fan
Built-in process timer, purge timer and UV lamp hour counter
Cleaning Silicon and Silicon Nitride AFM/SPM Probes
UVFAB Systems
UVFAB Systems
UVFAB Systems, Inc.