We have a wide range of manual wafer mounting systems available for various applications, from research and development to semi-custom production. The manual wafer mounter series supports three different wafer sizes: 300mm, 200mm, and 150mm and can be manufactured for either dicing film or back grind film lamination.

Our manual wafer mounting systems can also be used in packaging, glass, ceramic, and various other types of substrates, and can also be customized to meet special user specifications.

A twin-type manual wafer mounter is also available. With this special model, you can simultaneously set two tapes or films, such as a normal adhesive tape and a UV tape, on a single wafer mounter. This eliminates the need to change tapes.