A wafer expander is a tape expansion device that expands diced wafers uniformly in the X and Y directions, expands the chip spacing to any gap specified, and significantly improves chip handling after dicing / singulation.

EX Series “Wafer Expander” is a tape expansion device that can attach diced wafers together with dicing tape in an expansion stage, and uniformly spread chip spacing / street width to a specified width.

After expansion, the grip ring (automatic pinching of the inner ring and outer ring) holds the tape in the expanded state.