UV-Ozone Cleaning Applications
- Cleaning Silicon and Silicon Nitride AFM/SPM Probes
- Ultraviolet Curing of UV-adhesives
- UV photo-patterning of SAM surfaces
- Cleaning Surface Plasmon Resonance (SPR) chips
- Cleaning Quartz Crystal Microbalance (QCM) sensors
- Wafer Cleaning
- Surface Disinfection and Cleaning
- Surface Activation
- Cleaning Silicon and Silicon Nitride AFM/SPM Probes
- Ultraviolet Curing of UV-adhesives
- UV photo-patterning of SAM surfaces
- Cleaning Surface Plasmon Resonance (SPR) chips
- Cleaning Quartz Crystal Microbalance (QCM) sensors
- Wafer Cleaning
- Surface Disinfection and Cleaning
- Surface Activation
Why UV Ozone Cleaning Process?
While there are several options for surface cleaning and sample preparation methods, UV-ozone cleaning shows several advantages over other methods.
- Improved wettability resulting in better bonding and coating adhesion
- Does not damage materials
- Simple, fast and cost effective method of cleaning
- Does not induce electrostatic charge on samples
- Low Charging Damage on Substrates – In case of plasma treatment, charging damage caused by ion bombardment can be a serious challenge. It leads to degradation of electrical characteristics of devices. UV-ozone treatment offers surface treatment using oxygen radicals without plasma discharge.
- No Hazardous Effluent – Wet cleaning requires effluent disposal of chemicals. In contrast to the wet cleaning method, UV-ozone treatment is a completely dry and chemical-free process.