UVFAB manufactures compact, table-top UV-Ozone cleaning systems for removal of organic contamination from various types of surfaces using UV light. Our systems come equipped with low-pressure Mercury UV grid lamps, ensuring a highly uniform exposure of 254 nm and 185 nm wavelengths.

Our UV Ozone Cleaners provide a simple, inexpensive and fast method of obtaining ultra-clean surfaces on most substrates, such as quartz, silicon, gold, nickel, aluminum, gallium arsenide, alumina, glass slides, etc. Ultra-clean surfaces can easily be achieved by utilizing a UV Ozone Cleaner which is chemical free and touch-less.

The UV Ozone Cleaning process is a photo-sensitized oxidation process in which the contaminant molecules of photoresists, resins, human skin oils, cleaning solvent residues, silicone oils, and flux are excited and/or dissociated by the absorption of short wavelength UV radiation. Atomic oxygen is simultaneously generated when molecular oxygen is dissociated by 185nm and ozone by 254nm ultraviolet wavelengths. The 254nm UV radiation is absorbed by most hydrocarbons and also by ozone. The products of this excitation of contaminant molecules react with atomic oxygen to form simpler, volatile molecules which desorbs from the surface. Therefore, when both UV wavelengths are present atomic oxygen is continuously generated, and ozone is continually formed and destroyed. Using UVFAB’s UV Ozone Cleaning systems, near atomically clean surfaces can be achieved in minutes without any damage to your devices.

UV-Ozone Cleaning Applications

  • Cleaning Silicon and Silicon Nitride AFM/SPM Probes
  • Ultraviolet Curing of UV-adhesives
  • UV photo-patterning of SAM surfaces
  • Cleaning Surface Plasmon Resonance (SPR) chips
  • Cleaning Quartz Crystal Microbalance (QCM) sensors
  • Wafer Cleaning
  • Surface Disinfection and Cleaning
  • Surface Activation
  • Cleaning Silicon and Silicon Nitride AFM/SPM Probes
  • Ultraviolet Curing of UV-adhesives
  • UV photo-patterning of SAM surfaces
  • Cleaning Surface Plasmon Resonance (SPR) chips
  • Cleaning Quartz Crystal Microbalance (QCM) sensors
  • Wafer Cleaning
  • Surface Disinfection and Cleaning
  • Surface Activation

Why UV Ozone Cleaning Process?

While there are several options for surface cleaning and sample preparation methods, UV-ozone cleaning shows several advantages over other methods.

  • Improved wettability resulting in better bonding and coating adhesion
  • Does not damage materials
  • Simple, fast and cost effective method of cleaning
  • Does not induce electrostatic charge on samples
  • Low Charging Damage on Substrates – In case of plasma treatment, charging damage caused by ion bombardment can be a serious challenge. It leads to degradation of electrical characteristics of devices. UV-ozone treatment offers surface treatment using oxygen radicals without plasma discharge.
  • No Hazardous Effluent – Wet cleaning requires effluent disposal of chemicals. In contrast to the wet cleaning method, UV-ozone treatment is a completely dry and chemical-free process.
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Semiconductor Wafer ID Readers, UV-Ozone Cleaning Systems and Handheld UV Disinfection
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